About Us

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow and Singapore plus regional sales and technical support sites in Glasgow, Tigard (Oregon, USA) and Shanghai (China).

FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms.

FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

Corporate Headquarters

Future Technology Devices International Limited

  • Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow, G41 1HH, United Kingdom
  • Tel: +44 (0) 141 429 2777
  • Fax: +44 (0) 141 429 2758
  • E-Mail (Sales): sales1@ftdichip.com
  • E-Mail (Support): support1@ftdichip.com
  • E-Mail (General Enquiries): admin1@ftdichip.com
  • Web Site URL: https://www.ftdichip.com

Disclaimer

Links to external websites and documents contained in the FTDI website are not the responsibility of FTDI and no responsibility will be accepted for their content. Though the information provided here is believed to be accurate at the time of writing, it is supplied in “good faith” and, as such, is provided without any warranty whatsoever as to it’s accuracy and completeness.

Opinions expressed should not be taken as an endorsement by Future Technology Devices International Ltd. of any company or services mentioned herein.

System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance requirements. All application-related information provided by FTDI (including application descriptions, suggested FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the user’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use.

Corporate Responsibility Documents

FTDI Chip Anti-Corruption and Bribery Policy Statement

FTDI Chip Counterfeit Statement